The UFS 3.1 standard (JESD220E) utilizes a 153-ball BGA (Ball Grid Array) package, typically measuring
These pins handle the actual data transfer using the MIPI M-PHY physical layer. UFS 3.1 typically supports up to two lanes in each direction (full-duplex). ufs 3.1 pinout
To understand the pinout, one must first understand the architecture. eMMC relied on a parallel bus (8 data lines) to transfer data. UFS uses a serial interface with differential signaling, similar to SATA or PCI Express, but specifically optimized for low power consumption. The UFS 3
| Pin Number | Pin Name | Description | | --- | --- | --- | | 1 | VDD | Power supply voltage | | 2 | VSS | Ground | | 3 | REFCLK | Reference clock | | 4 | REFCLK | Reference clock (complement) | | 5 | DNC | Do not care (reserved) | | 6 | DNC | Do not care (reserved) | | 7 | RXD0 | Receive data 0 | | 8 | RXD1 | Receive data 1 | | 9 | RXD2 | Receive data 2 | | 10 | RXD3 | Receive data 3 | | 11 | TXD0 | Transmit data 0 | | 12 | TXD1 | Transmit data 1 | | 13 | TXD2 | Transmit data 2 | | 14 | TXD3 | Transmit data 3 | | 15 | CBT | Control signal ( Command, BE and Transfer) | | 16 | VSS | Ground | The Shift from Parallel to Serial To understand
UFS 3.1 | Universal Flash Storage | Samsung Semiconductor Global
For phone repair: If a water-damaged phone doesn't detect UFS, measure diode mode to ground on VCC, VCCQ, and REF_CLK. A short to ground on REF_CLK often indicates a cracked chip or solder bridge under the BGA.